News
This report gives showcase insight in the most extensive manner. The report structure has been kept to such an extent that it offers the greatest business esteem. It gives basic bits of knowledge into the market elements and will empower vital basic leadership for the current market players just as those ready to enter the market.
-
This report gives showcase insight in the most extensive manner. The report structure has been kept to such an extent that it offers the greatest business esteem. It gives basic bits of knowledge into the market elements and will empower vital basic leadership for the current market players just as those ready to enter the market.
-
2808-2019
Printed circuit board
The instruction of PCB
-
While the PCB is heated, part of the free volume of water can be dissipated through the microporous PCB substrate, thereby reducing the molar volume fraction of water that may accumulate at the voids or microcracks, which is beneficial to the explosion of the PCB. improve. However, if the surface of the PCB has a large area of copper foil pattern coverage, when the PCB is heated, the large copper foil surface above the buried hole blocks the water vapor that escapes outward after being heated, so that the pressure of water vapor in the microcrack increases, resulting in occurrence of The chance of a burst is greatly increased.
-
As the temperature continues to rise, the gas accumulated in the vicinity of the buried hole is more and more, forming a large expansion pressure, so that the browning surface of L2 and the PP are subjected to a separation force for separating them.When the final expansion pressure (f) is less than the adsorption force (F) between the browning surface and the PP (f
F), separation occurs between the browning surface of L2 and PP. A distinct blocky blistering phenomenon. -
In the following, the existence of water in the PCB, the way of water vapor diffusion and the change of water vapor pressure with temperature, reveal that the existence of water vapor is the primary cause of PCB explosion.
-
Top 6 PCB Industry Trends and the Manufacturing Challenges They Present
-
1709-2019
The main forms of PCBA testing
ICT test, FCT test, aging test, fatigue test, and test in the harsh environment. The PCB proofing board is described as follows:
-
U.S. Customs and Border Protection (CBP) launched Simplified Arrival at Detroit Metropolitan Airport (DTW) today, September 25. Simplified Arrival is modernizing international arrivals for air travelers and crew by automating processes and biometrically matching the traveler to their travel document using face comparison technology.
-
2611-2019
Market Insights Of PCB & PCBA Market By Top Key Players, Size, Drivers & Market Dynamics Forces 2024
The Global PCB & PCBA Market is poised to grow strong during the forecast period 2017 to 2027. PCB & PCBA market is the definitive study of the global PCB & PCBA industry. The report content includes technology, industry drivers, geographic trends, market statistics, market forecasts, producers, and raw material/equipment suppliers.
-
2308-2019
Pcba processing quality agreement
PCB circuit board manufacturing in the following process,strict requirement to ensure your product quality and save more electronics budget
-
2506-2019
PCB assembly yield
How to improve solderability during SMT for the high voltage products, led lights, power supply products, and controller boards?