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Intelligent Transportation System Market Analysis: Global Product Intelligence Industry Analysis 2023

This report gives showcase insight in the most extensive manner. The report structure has been kept to such an extent that it offers the greatest business esteem. It gives basic bits of knowledge into the market elements and will empower vital basic leadership for the current market players just as those ready to enter the market.

  • This report gives showcase insight in the most extensive manner. The report structure has been kept to such an extent that it offers the greatest business esteem. It gives basic bits of knowledge into the market elements and will empower vital basic leadership for the current market players just as those ready to enter the market.

  • The instruction of PCB

  • While the PCB is heated, part of the free volume of water can be dissipated through the microporous PCB substrate, thereby reducing the molar volume fraction of water that may accumulate at the voids or microcracks, which is beneficial to the explosion of the PCB. improve. However, if the surface of the PCB has a large area of copper foil pattern coverage, when the PCB is heated, the large copper foil surface above the buried hole blocks the water vapor that escapes outward after being heated, so that the pressure of water vapor in the microcrack increases, resulting in occurrence of The chance of a burst is greatly increased.

  • As the temperature continues to rise, the gas accumulated in the vicinity of the buried hole is more and more, forming a large expansion pressure, so that the browning surface of L2 and the PP are subjected to a separation force for separating them.When the final expansion pressure (f) is less than the adsorption force (F) between the browning surface and the PP (fF), separation occurs between the browning surface of L2 and PP. A distinct blocky blistering phenomenon.

  • In the following, the existence of water in the PCB, the way of water vapor diffusion and the change of water vapor pressure with temperature, reveal that the existence of water vapor is the primary cause of PCB explosion.

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